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Mako Hotend for Bambu Lab X1 And P1 High Flow CHT FIN Upgrade Bondtech

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22,818.98 

Mako Hotend for Bambu Lab X1 And P1 High Flow CHT FIN Upgrade Bondtech

Mako Hotend for Bambu Lab X1 And P1 High Flow CHT FIN Upgrade Bondtech

  • Bondtech Mako Hotend for Bambu Lab. Engineered for seamless compatibility with X1 and P1 series machines, this performance upgrade increases melt capacity and enables dramatically faster printing.
  • The protective roll cage simplifies maintenance and allows rapid, one-handed nozzle replacement.
  • When paired with Bondtech CHT FIN nozzles, users can achieve up to 60% higher flow while maintaining excellent layer adhesion and long service life.
  • Mako Hotend for Bambu Lab by Bondtech is a high-flow, quick-service upgrade built to maximize speed, uptime, and reliability. Designed to integrate cleanly with Bambu Lab X1 and P1 platforms, the reinforced roll-cage construction allows safe, one-handed nozzle swaps while supporting powerful CHT FIN melt technology.

Specifications

  • Product: Mako Hotend
  • Brand: Bondtech
  • Printer support: X1 / P1 series
  • Nozzle ecosystem: CHT FIN compatible
  • Service method: Quick swap / tool friendly
  • Construction: Reinforced metal structure
  • Performance goal: Higher flow & reliability
  • Usage: Industrial, farm, professional
  • Lead time: 4–6 weeks

Features

  • Direct drop-in compatibility with Bambu Lab platforms
  • Roll cage architecture for easy handling
  • One-handed nozzle changes
  • Supports Bondtech CHT FIN high-flow system
  • Up to 60% faster printing capability
  • Designed for thousands of hours of operation
  • Reduced downtime & faster maintenance
  • Professional-grade thermal performance

Variation Options

  • Pre-installed electronics (P1P / P1S)
  • Pre-installed electronics (X1 / X1C)
  • Pre-installed electronics (X1E)

Nozzle Options

  • GammaMaster FIN 0.4 mm
  • Bondtech CHT FIN 0.4 mm

Package Includs

  • 1 piece of Mako Hotend
Weight 150 g
Brand

Bondtech

Product

Mako Hotend

Type

Pre-installed electronics (P1P / P1S), Pre-installed electronics (X1 / X1C), Pre-installed electronics (X1E)

Size

GammaMaster FIN 0.4 mm, Bondtech CHT FIN 0.4 mm

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